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Home > Products > Semiconductor Parts > Copper Clad Ceramic Plate Series > Copper clad ceramic plate has good thermal cycling properties
Copper clad ceramic plate has good thermal cycling properties
Copper clad ceramic plate has good thermal cycling properties
Copper clad ceramic plate has good thermal cycling properties
Copper clad ceramic plate has good thermal cycling properties
Copper clad ceramic plate has good thermal cycling properties
Copper clad ceramic plate has good thermal cycling properties
Copper clad ceramic plate has good thermal cycling properties
  • Copper clad ceramic plate has good thermal cycling properties
  • Copper clad ceramic plate has good thermal cycling properties
  • Copper clad ceramic plate has good thermal cycling properties
  • Copper clad ceramic plate has good thermal cycling properties
  • Copper clad ceramic plate has good thermal cycling properties
  • Copper clad ceramic plate has good thermal cycling properties
  • Copper clad ceramic plate has good thermal cycling properties

Copper clad ceramic plate has good thermal cycling properties

    Unit Price: USD 0.058 - 0.082 / Others
    Payment Type: L/C,T/T,Paypal
    Incoterm: FOB,CFR,CIF

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Basic Info

Model No.YZPST-Copper clad ceramic plate series

BrandYZPST

Place Of OriginChina

Copper Layer Peeling Strength≥6N/mm@50mm/min

Temperature-55℃-850℃

Surface RoughnessRa≤3um

Thermal Conductivity24W/m.K@25℃

Dielectric Constant9.8±10%@1MHz

Dielectric Loss≤0.0003@23℃,1MHz

Additional Info

Packaging1. Anti-electrostatic packaging 2. Carton box 3. braid

Productivity10000000000

TransportationOcean,Land,Air,Express

Place of OriginCHINA

Supply Ability10000000000

PortSHANGHAI

Payment TypeL/C,T/T,Paypal

IncotermFOB,CFR,CIF

Product Description

physical property
Copper clad ceramic plate series1
Copper coated ceramic plate:
It is an electronic base material made by directly sintering copper boxes on ceramic surfaces, which has good thermal cycling properties: high mechanical strength, high thermal conductivity, high insulation properties, and high current carrying capacity.
Suitable for packaging materials of high-power IGBT modules, thyristor modules, and semiconductor refrigeration and heating devices. surface appearance:
1 . Double sided copper 2. Single sided nickel 3. Double sided tin copper surface with OSP anti oxide film for soldering.
Product quality control:
Adopting fully automatic detection, automatic marking, and X-RAY non-destructive testing equipment for control.
Copper clad ceramic plate series1-1

Product Categories : Semiconductor Parts > Copper Clad Ceramic Plate Series

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